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Description

Dexnyl PI is available in 2 different particle sizes and specifications. Our Dexnyl PI Powder 100P_19 very suitable for compounding and compression molding application and our Dexnyl PI Powder 260_19 is very suitable for producing compression molded part and direct formed parts.

Using sinter technology, polyimide powder can be manufactured into semi-finished products and components. Industrial applications profiting from this material’s effectiveness range from automotive industry and aerospace to industrial applications and office machines. Compounds with solid lubricants like graphite, molybdenum sulfide or PTFE can be used for tribologically demanding applications.

The range of products that can be produced from our polyimide (PI) is only limited by the processing machines. Polyimide powder can be processed by hot compression molding, direct forming, iso-static compression molding or it can be compounded with other materials as an additive. Polyimide powder is often compounded with PTFE to increase certain properties of the PTFE.

TYPICAL PROPERTIES STANDARD UNIT Data 100P_19
Appearance Pale Yellow
Fineness mesh 1000
Specific Gravity g/cm3 1.42-1.43
Rockwell Hardness GB/T3398.2-2008 106
Limiting Oxygen Index GB/T2406.2-2009 % 50
CTE ASTM E 831 ppm/℃ 50-55
Dielectric strength GB/T1408.1-2006 KV/mm 20-50
Glass Transition Temperature DSC, 10℃/min, N2 385
Thermal decomposition temperature TGA, Td5 590
Friction coefficient GB/T3960-1989 0.35
Volumetric Wear Rate GB/T3960-1989 cm3 0.022

 

TYPICAL PROPERTIES STANDARD UNIT Data 260P Remark
Appearance Yellow
Density GB/T1033(A) g/cm3 1.42-1.43
Apparent Density g/cm3 0.26-0.40
Friction Coefficient GB/T3960-1989 Against Oil Steel 0.30
HDT GB/T1634 >360
Tg ISO 11358-1:2014 370
Heat Loss Temperature ISO 11357-2:2013 585 Weight Loss 5%
Impact Strength KJ/m2 >20
Tensile Strength GB/T 1040.2/1A -2006 MPa 35
Bending Strength GB/T 9341-2008 MPa 48
Compressive Strength GB/T 1041-2008 MPa 155
Friction Coefficient GB/T 3960-2016 0.38
Abrasion GB/T 3960-2016 mg 13.4
Rockwell Hardness GB/T 3398.2-2008 99
Thermal Expansion Coefficient GB/T 1036-2008 1/℃ 4.01*10^-5 23-80℃
Dielectric Strength GB/T 1408.1-2006 KV/mm 13.1
Volume Resistivity GB/T 1410-2006 Ω.m 5.5*10^14
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